Published at LXer:
Via Technologies announced a 2.36 x 2.36-inch computer-on-module (COM) based on its new Mobile-ITX form factor. The Via Epia-T700 is built around a 1GHz Via Eden ULV processor with 512MB soldered DDR2 memory, and supports the development of ultra-compact embedded devices in medical, military, and in-vehicle applications, says the company.
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