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Old 09-08-2011, 01:30 AM   #1
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LXer: 3M, IBM collaborate on chip stacking

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IBM and 3M announced they'll work together to develop adhesives that will help package semiconductors into dense towers of silicon. By including up to 100 layers, the resulting chips could be up to 1,000 faster than today's speediest microprocessors, the companies claim....



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