Slackware - ARMThis forum is for the discussion of Slackware ARM.
Notices
Welcome to LinuxQuestions.org, a friendly and active Linux Community.
You are currently viewing LQ as a guest. By joining our community you will have the ability to post topics, receive our newsletter, use the advanced search, subscribe to threads and access many other special features. Registration is quick, simple and absolutely free. Join our community today!
Note that registered members see fewer ads, and ContentLink is completely disabled once you log in.
If you have any problems with the registration process or your account login, please contact us. If you need to reset your password, click here.
Having a problem logging in? Please visit this page to clear all LQ-related cookies.
Get a virtual cloud desktop with the Linux distro that you want in less than five minutes with Shells! With over 10 pre-installed distros to choose from, the worry-free installation life is here! Whether you are a digital nomad or just looking for flexibility, Shells can put your Linux machine on the device that you want to use.
Exclusive for LQ members, get up to 45% off per month. Click here for more info.
I'm considering ordering a RockPro64. There is an aluminium case for it that has a "Built-in heat pipe (plate) that directly contact[s] with SoC". Has anybody used one of these cases and does it provide adequate cooling?
If that is the case than I would probably first install Slackwarearm out of the case and then install the board in the case after the install. Would installing without a heat sink or heat sink with fan pose a risk of overheating and damaging the SoC?
I'm considering ordering a RockPro64. There is an aluminium case for it that has a "Built-in heat pipe (plate) that directly contact[s] with SoC". Has anybody used one of these cases and does it provide adequate cooling?
If that is the case than I would probably first install Slackwarearm out of the case and then install the board in the case after the install. Would installing without a heat sink or heat sink with fan pose a risk of overheating and damaging the SoC?
I have one of these cases for the desktop test machine and haven't had any problems with it so far.
Running the Slackware Installer without a fan or heat sink will be fine, but not running it long term - I ran one without and it became damaged. I don't know if not having a fan or heat disspipation was the cause of the damage but I suspect it was since the machine was also used for compiling large applications.
My aluminium case is slightly warm to the touch - I'll take a reading with the laser thermometer if you like ;-)
The thermometer was previously registering 20deg C, but having left it next to the RockPro64 case for a minute whilst I prepared the camera, it rose by 2.5 deg!
here is a comparison for rpi4: https://www.martinrowan.co.uk/2019/0...aspberry-pi-4/
I have a fanless aluminium case, there was no any problem with it. But obviously it may depend on the load, so probably better to buy a different one with a fan for you.
Additionally you cannot damage that device, because it will automatically handle overheating.
LinuxQuestions.org is looking for people interested in writing
Editorials, Articles, Reviews, and more. If you'd like to contribute
content, let us know.
