LinuxQuestions.org - Intel Core 2 Quad Q6600 *VS* Intel Core 2 Duo E6850

- Linux - Hardware (https://www.linuxquestions.org/questions/linux-hardware-18/)

- - Intel Core 2 Quad Q6600 *VS* Intel Core 2 Duo E6850 (https://www.linuxquestions.org/questions/linux-hardware-18/intel-core-2-quad-q6600-%2Avs%2A-intel-core-2-duo-e6850-633007/)

Quote:

Originally Posted by BallsOfSteel (Post 3119424)

I'm not saying to completely do away with air cooling. I imagine that the OP would still have a case fan or two. When it comes to specific components that you're cooling, it's a great solution. Here's a new article in /. advocating the use of liquid cooling and it's a cheaper solution: http://hardware.slashdot.org/hardwar.../2049205.shtml

It may be a little more risky, but you CANNOT deny it's effectiveness on cooling processors and GPUs. Which appears to be one of the main causes for concern for the OP when it comes to overclocking.

I am not missing the point of liquid cooling. It fails in another key area that enthusiast forget. The motherboard components such as capacitors, resistors, inductors, MOSFET, and IC needs cooling too. The only way they get their temperature down is from the CPU heat sink that contains a fan to cool the components. Liquid cooling takes away this feature and over clocking performance of the desire board is then penalized.

The only time that liquid cooling did well is when using liquid nitrogen.

I prefer to buy a very, very efficient active air heat sink and turn down the air conditioner to cool the computer off.

Quote:

Originally Posted by Electro (Post 3119593)

The motherboard components such as capacitors, resistors, inductors, MOSFET, and IC needs cooling too. The only way they get their temperature down is from the CPU heat sink that contains a fan to cool the components.

I agree. For example on my motherboard, there's an extra heat sink that has to be attached to a large group of capacitors (and other components) on the board. This group of components must get quite hot if they need a separate heat sink. Therefore air must circulate in the case for these components to cool properly.