Laptop overheating especially when compiling package
Hi all fellow slackers, I have a problem with my laptop. When idle, the temperature (I know it using tlp-stat -t command) is around 65 degree Celcius and when compiling my laptop it's around 85 degree and sometimes it just shutdown because it overheated. Probably the temperature is more than 100 degree.
Some information about my system:
My lsmod output: Code:
Module Size Used by Any help will be much appreciated. Thanks :) |
Someone will probably suggest to clean dust and change the thermal paste if possible. As I had the same problem I ended up getting a cooler (Zalman ZM-NC1500B). Its not expensive (I paid 32€95 including 19.6% VAT in Paris) nor too noisy and does the job.
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i8kutils from slackbuilds solved the problem on my dell laptop, might work on yours too.
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Mine is HP laptop. i8kutils is for dell :( |
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This is a software problem. While replacing the thermal paste and cleaning out the cooling system isn't a bad thing, it will not fix the overheating.
The problem is that you use the Slackware kernel. The 3.10 kernel lacks dynamic power management for your videocard, so that it by default always runs on full power, heating up the system. Install a 3.13 kernel, which has dynamic power management enabled by default and you should immediately see much better temperatures. |
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But what I know for sure is that I use the cooler whenever I use a VM or do demanding compilations and the laptop doesn't get hot anymore. I hope that'll extend its life several of several years. Of course you can try a 3.13 kernel, as TobiSGD suggested (though it be fairly new so if that was me I would wait a few weeks till it has been more widely used so possibly some more bugs in it will be fixed). Notwithstanding I think it's a shame that we can't use our laptops at their full potential without overheating, but that's another topic. |
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Or poorly assembled. I have seen brand name laptops in which the heatsink did not make firm contact with the CPU. Others must resort to overly thick so-called thermal paste tabs with dbl-sided adhesive. Ridiculous. Even the best designed laptops rarely like to have holes, even as grillework, so airflow is not at a premium.... looks are. This is horrible too. Anything you can do to improve heat transfer is smart work. Even a copper shim between HS and CPU with proper thermal compound, can make your laptop more usable and for a lot longer, if poorly designed or assembled. Sadly, many consumer laptops are both.
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That reminds me of the mobile desaster that NVIDIA had with their G84 or NVS135M graphic chips. The first bunch they produced failed when they reached 90 degrees or above, so NVIDIA had to produce a new one that could withstand the heat. A better option would have been to just produce notebooks that don't behave like microwaves - but that would have been to easy. I have an old Fujitsu notebook here with a chip from the first (faulty) series. It is never reaching these high temperatures and playing games is no problem on that device. On the other hand, a Dell D630 with the same chip failed two times (the second time after two weeks). At least there are still good notebooks out there with a good coolant system. You just have to look. The Thinkpad series from Lenovo is still one of the most reliable in my opinion. |
reduce heat
From what I have seen with my Dell D630 from 2007:
-overheating is caused by heavy graphics, desktop environment, cpu demanding programs. -you use the nouveau video drivers and this is hotter by ~10°C , use the proprietary drivers instead. Find an older version if the newest is causing problems. -try the 3.2.53 kernel - and almost forgot but you can use the jfs file system and you will get lower cpu usage (lower temps) than ext4 . -you can try to underclock the cpu a little and not letting it to go to max all the time by adding this to /etc/rc.d/rc.local : cpufreq-set --cpu 0 --max 1200000 cpufreq-set --cpu 1 --max 1200000 After setting the max frequency for ondemand governor now I read from sensors: temp1: +34.5°C (crit = +99.0°C) PS: If you tweak the cpu frequency to minimum you don't have to worry about heat anymore :) |
All the right modules are modprobed, so I suspect a hardware issue. Probably the fans are clogged with dust, and you may want to use compressed air to clean all the air ports. As this is a laptop, I do NOT recommend taking it apart. If the problem persists I would ask the manufacturer about the issue.
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If it is out of warranty or you don't care about warranty. If it is not your main or a production machine, or you have a backup machine. If you're just sick of risking sterility everytime you actually place it on your lap and the manufacturer won't do anything about it. Laptops are not rocket surgery. Like a PC all the components are keyed so they only go together one way. As long as you pay attention to the order that things disassemble and don't just yank on wires but grasp the connectors and activate any obvious locking mechanism disassembly is no big deal for anyone with even moderate mechanical skills. The only gotcha here is that sometimes manufacturers cover up the locations of bolts or screws with adhesive labels - not that big of a deal to discover and defeat. Re-Assembly just requires not overtightening into plastic, brass or aluminum and it isn't a bad idea to use the crosshatch method of applying torque evenly. Do it in diagonals a step at a time and it's easy peasy. The most important thing to remember and follow in both steps is to use the right tools. Don't try to use a Phillips Screwdriver that is too big or too small for a bolt head. I really don't have to say don't use a flat blade on a phillips do I? If your laptop uses Torx heads, stop, and do not continue until you have the proper tool. For most people as long as you don't rush, you will be just fine. Just think it through before you commit to an action. There is no shame in putting it back together and thinking about it for a few days while you re-evaluate your skills to go any further. Obviously if you decide to do this the responsibility is all yours but there is a lot of help on the Net, including here. A big plus is de-mystifying your lil' lap buddy. It's just a machine and one that is built to be easily assembled on a line. Not magic. |
Since you have a laptop, you might also want to search Slackbuilds for Laptop related tools to manage fan controls, power usage, and other laptop related factors.
laptop-mode-tools is a must have, as is ibam, and maybe wmpower, all of which are available from www.slackbuilds.org website. |
If you are sure that it is a hardware issue, the manufacturer won't help, it is out of warranty and you have some skill, then you could open it. I would take a camera to record each step, because putting it back together is gonna be hard. You may also want to find a tear-down video / howto before you start.
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Underclocking the CPU, gah. By aprox 50% as well, thats _really_ going to hurt performance. It might help overheating when compiling, but that is ignoring the real problem...and its quite likely the laptop will still overheat. Quote:
Also, NVS 135 is G84M, and basicly the same chip as used in the 8400M G/GS/GT. |
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OP go from general to specific. Either narrow down the cause (best) or eliminate all possible causes (weak, but workable)
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It can also be worthwhile just to remove the battery if you expect a long term on AC power, or as OP mentioned, during a particularly intense task on AC. Quote:
In addition to making certain there is good heat transfer between the CPU and it's heatsink (and also the GPU and it's, if it has one) one should look to see if there is any obvious spot to improve airflow. Just don't drill any holes, especially in metal, without the means to insure complete and utter clean up afterwards. A Nibbler on plastic works wonders and a thin sheet of packing foam can act as a filter and cosmetic cover if you decide to add what amounts to a new air intake. If you have a good reason not to modify your hardware, even fear, then just don't, but for most people with any decent tools and skills to use them, the improvement can be absolutely dramatic. I have seen 20 C reductions at idle, and far greater resistance to change under load. Just more stable. Quote:
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check this out http://www.linuxquestions.org/questi...8/#post4830372
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Its also possible that there will not be enough pressure on the heatsink, and in those cases adding a shim can help. Adding a shim in most (all?) other cases just adds more layers and more thermal paste, which reduces the efficiency of the cooling system. Quote:
Its fixable in most Intel CPU/AMD GPU or AMD CPU/AMD GPU situations with vgaswitcharoo or by using the fglrx closed driver. (Intel CPU/nVidia GPU and AMD CPU/nVidia GPU setups are now almost always 'optimus' and work better with bumblebee). |
Just some comments for clarity
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The occurrence of an actual and substantial air gap on many laptops is due to factory assembly methods. Parts that fit together precisely are generally anathema to assembly line speed, so manufacturers often resort to extremely thick wafers of "thermal pads". This is at best, "fooling oneself" since even the best thermal paste does not have a coefficient even approaching metal to metal contact. It's just better than air. Thermal paste should be applied in as thin a layer as possible. Ideally much of the mating surfaces should NOT be separated by paste so that it only fills the low spots preventing air pockets. It is not uncommon to see thermal wafers used that are 1/16th inches thick (0.0625) and I have witnessed some closer to 1/8th inch (0.125). It is only a very slight improvement to replace this entire thickness with the same thickness of even high quality thermal paste, the primary benefit being simply eliminating the adhesive layers on both sides. Not the best improvement, but some. Consider this: A person could coat his finger tip with a thick layer of thermal paste and apply a match to it with very little danger of a burn. DO NOT try that with a copper shim with a thin layer on both sides. Does that make it more real for you?. A less dramatic test that is safer to try is this. Put a blob of thermal paste, or better one of those ridiculous wafers, on a nonflammable surface and hold a match or a lighter to it for say, 5 full seconds. The blob, if the mass approaches anywhere near the amount actually used on many laptop heatsinks, will not even be uncomfortably warm in 5 seconds. A wafer can get uncomfortable but not deliver a burn even though the adhesive will ignite and burn for a few seconds too, and in direct intimate contact with the paste. Again, DO NOT try this with a shim of similar mass with a thin layer of paste. FTR, I have done both of these tests, but only after I employed a VOM with a thermal transducer probe to measure actual temps. (I may be crazy but I'm not an idiot :P ) Heat in electronics is the enemy and I take it very seriously, and defeat it with extreme prejudice and knowledge gained from many years of work in the field. You do what you want, but I will never own for long any electronics (other than Vacuum Tube) that will idle at 65 C. |
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BTW, its normally called 'lapping', not 'polishing'. Quote:
But that is bad design and bad manufacturing. I seen lots of people suggest shims over the years, and sometimes I've seen people even say 'adding a shim will help in all situations becasue copper conducts heat better than aluminium'. Thats a bit silly, as you can get pure copper and copper bottomed heatsinks. But even with an aluminium heatsink, its still very uncommon to see temps go down, they mostly go up. If there is a normal ('good' I spose) heatsink/CPU interface, adding a shim will just make things worse. The more thickness and layers you have, the harder it is for the heat to get out. That is why you can remove the intergrated heatspeader found in pretty much all current CPUs and improve temps. No, I am not suggesting that is a good idea for any normal user) Quote:
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I ran many systems with 40C+ room temps during summer for years. At 40C+, idle temps tend to the mid to high 50s at minimum. I've had idle temps go as high as 60C+ at times. No, its not a good idea. Quote:
I'd be trying to reinstall windows asw a temp test and/or install vgaswitcharoo, a new kernel etc. with linux before modding hardware. |
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http://en.wikipedia.org/wiki/Lapping You can 'polish' a sphere. You cant lap one. ;) *edit- actually, technically, you can 'lap' a sphere, but spherical lapping is not the same as plate lapping. Quote:
20C+ idle deltas are uncommon now thanks to CPU frequency scaling and better power management. But it used to be fairly common. Quote:
Thats a 13 C delta with Hyper-Threading, 21 C without. Given a 40C room thats a 53C/61C idle temp.... and that is with an aftermarket heatsink, which IIRC was better than the stock P4 heatsink... Quote:
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'Science' says that more layers of thermal grease = worse performance. Quote:
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